Browsing by Subject "QFN"
Now showing items 1-5 of 5
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Effect of Underfill Material & Gap Height on Reliability of low-k Large-Die Flip Chip Package under thermal Loading
The reliability assessment of package assembly is important to predict the performance of any microelectronic devices. Formation of fatigue cracks at the interface between the solder joint and component is the common failure ... -
MULTI-PHYSICS DESIGN OPTIMIZATION OF 2D AND ADVANCED HETEROGENOUS 3D INTEGRATED CIRCUITS
(2018-08-27)The convergence and miniaturization of computing and communications dictate building up rather than out. As planar device miniaturization continues to its ultimate limits, the complexity of circuit interconnections for 2-D ... -
OPTIMIZATION OF BOARD LEVEL RELIABILITY OF MICROELECTRONIC PACKAGES AND MODULES
(2018-08-28)Thermo-mechanical reliability estimation of electronic packages and modules provides an opportunity to predict the function life of semiconductor devices. The problem complexity lies in the fact that there are variety of ... -
SOLDER JOINTS DESIGN OPTIMIZATION OF QFN PACKAGES FOR DIFFERENT BOARDS BY INVESTIGATING SOLDER JOINT RELIABILITY
(2017-05-30)Quad Flat No-lead package (QFN) is one of the most cutting-edge technologies emerged in the market, exhibiting high performance and efficiency with unparalleled cost effectiveness. QFN, a leadless package, is an ideal ... -
THE RELATIONSHIP OF LIFE PREDICTION FOR QUAD FLAT N0-LEAD PACKAGE (QFN )PACKAGES USING 4 POINT BEND TEST AND THERMAL CYCLE TESTING
(2016-01-05)In the structural design of the Printed Circuit Boards, the stiffness modulus of the involved Fr4 and Cu layers play an important role. The 4 point bend test is one of the few test methods which is included in the JEDEC ...