JavaScript is disabled for your browser. Some features of this site may not work without it.
ATTENTION: The works hosted here are being migrated to a new repository that will consolidate resources, improve discoverability, and better show UTA’s research impact on the global community. We will update authors as the migration progresses. Please see MavMatrix for more information.
To characterize particular compositions of lead free solder, four point cyclic bending test was conducted to study the affects of accelerated stress testing on the package to board interconnects. Nine CTBGA packages with ...