Department of Mechanical and Aerospace Engineering
http://hdl.handle.net/10106/24826
2024-03-29T01:16:22ZDesign and implementation of a behavioral sequence framework for human-robot interaction utilizing brain-computer interface and haptic feedback
http://hdl.handle.net/10106/31839
Design and implementation of a behavioral sequence framework for human-robot interaction utilizing brain-computer interface and haptic feedback
Hazra, Sudip; Whitaker, Shane; Shiakolas, Panos S.
In assistive robotics, research in Brain Computer Interface aims to understand human intent to enhance Human-
Robot Interaction and augment human performance. In this research, a framework to enable a person with an upper
limb disability to use an assistive system towards maintaining self-reliance is introduced and its implementation and
evaluation are discussed. The framework interlinks functional components and establishes a behavioral sequence
to operate the assistive system in three stages; action classification, verification, and execution. An action is classified
based on identified human intent and verified through haptic and/or visual feedback before execution. The
human intent is conveyed through facial expressions and verified through head movements. The interlinked functional
components are an EEG sensing device, a head movement recorder, a dual-purpose glove, a visual feedback environment, and a robotic arm. Five volunteers are used to evaluate the ability of the system to recognize a facial
expression, the time required to respond using head movements, convey information through vibrotactile feedback
effects, and the ability to follow the established behavioral sequence. Based on the evaluation, a personalized training
data set should be used to calibrate facial expression recognition and define the time required to respond during
verification. Custom vibrotactile effects were effective in conveying system information to the user. The volunteers
were able to follow the behavioral sequence and control the system with a success rate of 80.00%, thus providing
confidence to recruit more volunteers to identify and address improvements and expand the operational capability
of the framework.
2023-05-23T00:00:00ZON THE DEVELOPMENT AND EVALUATION OF A FRAMEWORK FOR BRAIN-COMPUTER INTERFACE AND VIBROTACTILE FEEDBACK FOR HUMAN-ROBOT-INTERACTION IN VIRTUAL SPACES AND ROBOTIC HARDWARE
http://hdl.handle.net/10106/31838
ON THE DEVELOPMENT AND EVALUATION OF A FRAMEWORK FOR BRAIN-COMPUTER INTERFACE AND VIBROTACTILE FEEDBACK FOR HUMAN-ROBOT-INTERACTION IN VIRTUAL SPACES AND ROBOTIC HARDWARE
Hazra, Sudip; Whitaker, Shane; Shiakolas, Panos S.
Research in Brain-Computer Interface (BCI) aims to understand
human intent with the goal to enhance Human-Robot
Interaction (HRI) especially in the field of assistive robotics. The
goal of this research is to develop a behavioral sequence based
framework to help persons with upper limb disabilities to maintain
self-dependence. The framework aims to operate in stages
and links multiple functional components to identify human intent
and control a robotic arm. The development, operation, and evaluation
of the framework and the linked functional components to
acquire, process, evaluate, and map BCI signals generated using
facial expressions and head movements to predefined actions will
be introduced.The framework will integrate multiple functional
components such as a non-invasive BCI control device, a vibrotactile
haptic feedback device, a visual feedback environment, the
evaluation and training platform, and a robotic arm. The robot
pick, move and place actions are mapped to different facial expressions
and presented using haptic and visual feedback to the
user for classified action verification before performing the process
using a robotic arm. The initial evaluation of the developed
framework was 100% successful with two volunteers who also
provided constructive feedback. The initial successful evaluation
provides confidence to further test the framework with more volunteers
to identify limitations and/or areas of improvement and
its application for further research in HRI as it applies to assistive
robotic systems.
2023-02-08T00:00:00ZInvestigation of Thermal Performance Enhancement and Thermo-mechanical Assessment of ITE using Single-Phase Immersion Cooling Technology
http://hdl.handle.net/10106/31800
Investigation of Thermal Performance Enhancement and Thermo-mechanical Assessment of ITE using Single-Phase Immersion Cooling Technology
**Please note that the full text is embargoed until 08/01/2024** The use of air-cooling as a thermal management technique in data centers has consistently maintained its importance, however its efficacy is limited to CPUs with lower power requirements. The expenses and energy use related to the air circulation process for high-power density racks are deemed excessively costly. The limits of air cooling have aroused concerns owing to its low specific heat capacity and poor thermal conductivity, which result in reduced effectiveness. Consequently, a substantial discourse has emerged about alternate and effective cooling methods that provide supplementary advantages, such as the recuperation of waste heat. In light of the limitations associated with conventional air-cooling approaches, several operators of data centers are embracing inventive methodologies to alleviate the consequences caused by escalating power densities. A solution gaining traction for high-power IT equipment is immersion cooling. A comparison between forced convection air cooling and single-phase liquid immersion cooling (Sp-LIC) highlights substantial advantages in the latter. The direct contact of dielectric fluids with components enables higher heat dissipation.. This technique enhances IT equipment reliability by safeguarding against pollutants and harsh conditions. Furthermore, Sp-LIC reduces capital expenditure (CapEx) and energy costs by eliminating the necessity for fans and computer room air handler units.
The objective of this investigation are divided into two parts: thermal efficiency of immersed information technology equipment (ITE) and operational efficiency (overall life cycle of fluid, reliability of components, and serviceability). The thermal part of the study is further divided into 3 section: In first section, an in-depth numerical study is performed which explores multi-parametric optimization for heat sinks in forced convection within an open compute server design when immersed in single phase immersion fluid. Optimization at constant pumping power iterates pressure drop and thermal resistance minimization as objective functions. Varying fin count and fin thickness for a constant base thickness in aluminum heat sinks reveals the correlation between geometric parameters and objective functions. These results contribute to standard methodologies for optimizing heat sinks in immersion cooling. In the second section of the thermal study, a systematic empirical study is undertaken to examine the heat transfer and pressure loss characteristics of aluminum metal foams while immersed in a dielectric synthetic fluid. The research used metal foam specimens with core heights of 0.0127m (0.5 in), varying relative densities between 10.7 and 12.3 percent, and pores per inch (PPI) values of 5, 10, 20, and 40. The metal foams underwent exposure to several flow rates, heat fluxes and inlet fluid temperature. In the final section of the thermal study, the experimental methodology for obtaining the velocity fields using Particle Image Velocimetry (PIV) in a single-phase immersion tank is discussed. PIV is a non-intrusive optical measurement technique used to visualize and measure fluid flow velocity patterns. The velocity field data obtained from these experiments provides valuable insights into the fluid flow behavior and aids in understanding the thermal performance of the immersion cooling system.
The second part of the research aims to investigate the impact of immersion cooling on server reliability. While immersion cooling excels in thermal energy management compared to conventional air-cooling, there have been limited studies on its reliability. The assessment of material characteristics, such as modulus and glass transition temperature, has substantial significance in the mechanical engineering of electronic components. The substrate, which is an essential element of an electronic package, significantly impacts the dependability and failure mechanisms of electronics, both at the package and board levels. The use of established material compatibility tests, such as ASTM 3455, is applied with appropriate adjustments in compliance with the design recommendations for immersion-cooled IT equipment outlined by the Open Compute Project (OCP). The main objective of this research is to investigate the effects of thermal aging on the thermo-mechanical properties of various substrate cores when immsered in single-phase dielectric fluids. This research examines the effects of aging on the substrate core by subjecting it to synthetic hydrocarbon fluid (EC100), Polyalphaolefin 6 (PAO 6), and ambient air for a duration of 720 hours. The aging process is conducted at two different temperatures, namely 85°C and 125°C. The complex modulus and the glass transition temperature of the substrate core are then determined and compared before and after the aging process.
2023-08-25T00:00:00ZANALYZING THE THERMOMECHANICAL PERFORMANCE OF TG400G MATERIAL SUBSTRATE CORE UNDER IMMERSION COOLING
http://hdl.handle.net/10106/31790
ANALYZING THE THERMOMECHANICAL PERFORMANCE OF TG400G MATERIAL SUBSTRATE CORE UNDER IMMERSION COOLING
The relentless surge in demand for seamless information exchange through consumer electronics, driven by the indispensable role of the Internet, has given rise to an unprecedented need for data centres. Yet, the energy consumption of conventional data centres, where a significant one-third of energy usage is attributed solely to cooling, has triggered an urgent quest for energy-efficient solutions. Immersion cooling technology appears as a promising contender due to its exceptional prowess in managing thermal energy. However, its potential impact on the reliability of IT equipment needs a more profound exploration before widespread adoption can be realized.
This study embarks on a focused mission: to unravel the intricate effects of thermal aging on the thermo-mechanical attributes of low loss printed circuit boards (PCBs), specifically homing in on the TerraGreen 400G variant, within ambient air conditions. The investigation subjects these low-loss PCBs to varying temperatures (85°C and 125°C) and durations (720 hours) of thermal aging, both within EC100 and PAO6 environments. By meticulously scrutinizing alterations in complex modulus and Glass Transition Temperature (Tg) before and after aging, the study endeavours to unearth any shifts in the material's fundamental properties.
Anticipated outcomes of this research stand to give invaluable insights into the dependability and adaptability of TerraGreen 400G PCBs within immersion cooling scenarios. Such insights hold profound implications for the relentless pursuit of energy-efficient and environmentally considerate data centres. Moreover, the study's findings promise to cast a luminous beam on the terrain of electronics mechanical design by illuminating material behaviour amidst the rigors of thermal aging. In a world propelled by digital expansion, this investigation serves as a beacon, illuminating pathways to both greener data infrastructure and a more profound comprehension of materials under demanding thermal conditions.
2023-08-15T00:00:00Z