Browsing Library by Author "Xu, Huili"
Now showing items 1-1 of 1
-
Grain Structure Evolution Of Tin-based Lead-free Solder Joints In Electronic Packaging Assembly And Its Impact On The Fatigue Reliability
Xu, Huili (Materials Science & Engineering, 2014-03-12)Solder is one of the main joints materials used in the electronics for decades of years. It is not only the mechanical support but also conducts the electric signals in the electronics. However, the regulation of lead ...