Browsing Library by Subject "WCSP"
Now showing items 1-4 of 4
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A COMPARATIVE STUDY OF THE THERMO-MECHANICAL BEHAVIOR OF WCSP ASSEMBLY DUE TO DIFFERENCE IN PCBS’ LAYER THICKNESS
(2016-05-10)The reliability of Chip Scale Package assembly is of great concern for the electronic industry. Due to multiple function integration of the present devices there is a high demand of ultra-miniaturization of the integrated ... -
EFFECT OF SOLDER VOIDS AND DISTANCE TO NEUTRAL POINT (DNP) ON SJR OF WCSP UNDER REFLOW CONDITION AND THERMAL CYCLING
(2017-12-08)Since the introduction of Chip Scale Packages (CSP’s) in the early 2000s, they have become one of the biggest packaging trends in recent history. There are currently over 50 different types of CSP’s available throughout ... -
EFFECT OF VISCOELASTIC MODELING OF PCB ON THE BOARD LEVEL RELIABILITY OF WAFER CHIP SCALE PACKAGE (WCSP) IN COMPARISON TO ORTHOTROPIC LINEAR ELASTIC MODELING
(2017-01-13)The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials ... -
MULTI-PHYSICS DESIGN OPTIMIZATION OF 2D AND ADVANCED HETEROGENOUS 3D INTEGRATED CIRCUITS
(2018-08-27)The convergence and miniaturization of computing and communications dictate building up rather than out. As planar device miniaturization continues to its ultimate limits, the complexity of circuit interconnections for 2-D ...