Browsing Theses and Dissertations(library) by Author "Mundhe, Pradnya Chandrakant"
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RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS USING DROP TESTING
Mundhe, Pradnya Chandrakant (2018-01-09)In electronic industry Ball grid array (BGA) package, surface mount technology has been used widely, due to its robust design, high density connections and improved performance. In surface mount technology, solder joints ...