Browsing Theses and Dissertations(library) by Subject "3D Package, Through Silicon Via (TSV), Electronic Package, Crack Propagation, Stress Intensity Factor, J-integral, Thermal Loading."
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(2016-09-16)Today, there is a revolution in going for miniaturization in size of electronic packages. More thinner, lighter and complex packages are in use for almost every electronic device. This initiation was taken to the next level ...