Browsing Theses and Dissertations(library) by Subject "Viscoelastic modeling"
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EFFECT OF VISCOELASTIC MODELING OF PCB ON THE BOARD LEVEL RELIABILITY OF WAFER CHIP SCALE PACKAGE (WCSP) IN COMPARISON TO ORTHOTROPIC LINEAR ELASTIC MODELING
(2017-01-13)The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials ... -
IMPACT OF VISCOELASTIC PROPERTIES OF LOW LOSS PRINTED CIRCUIT BOARDS (PCBs) ON RELIABILITY OF WCSP PACKAGES UNDER DROP TEST
(2020-06-08)Reliability of electronic packages is a major concern as different failure modes are induced due to factors such as temperature loads, mechanical stresses, humidity, corrosion and so on. Finite element analysis (FEA) is ...