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STUDY OF CRACK PROPAGATION UNDER THERMAL LOADING ON A 3D TSV PACKAGE
(2016-09-16)
Today, there is a revolution in going for miniaturization in size of electronic packages. More thinner, lighter and complex packages are in use for almost every electronic device. This initiation was taken to the next level ...
IMPACT OF THERMAL AGING ON CRACK GROWTH BEHAVIOR OF LEAD FREE SOLDER INTERCONNECTS
(2018-05-24)
Reliability assessment helps in better performance of electronic packages. This also helps electronic device manufacturing company as well as the users to evaluate the life of any device. The microstructure, mechanical ...