• Login
    Search 
    •   ResearchCommons Home
    • Department of Materials Science and Engineering
    • Search
    •   ResearchCommons Home
    • Department of Materials Science and Engineering
    • Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-4 of 4

    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Thumbnail

    INTERFACE REACTION INDUCED STRESS DEVELOPMENT IN AN ALUMINUM THIN FILM COPPER BULK PLATE DIFFUSION COUPLE 

    Mishler, Michael Codie (2015-12-18)
    This thesis investigates the mechanism of the interface reaction induced intermetallic phase formation (IMC) and its impact on the interface reliability in Al-Cu diffusion couple pairing. This study is motivated by the ...

    Thumbnail

    NANOPARTICLE-BRIDGE ASSAY FOR AMPLIFICATION-FREE ELECTRICAL DETECTION OF OLIGONUCLEOTIDES 

    Teimouri, Manouchehr (2015-12-08)
    The aim of this research is to investigate a highly sensitive, fast, inexpensive, and field-applicable amplification-free nanoparticle-based oligonucleotide detection method which does not rely on any enzymatic or signal ...

    Thumbnail

    Material changes of bone following ishcemia of the immature femoral head 

    Aruwajoye, Olumide (2015-12-11)
    Legg-Calvé-Perthes disease (LCPD) is a childhood hip disorder resulting from the loss of blood flow to the femoral head. In severe cases of the disease, the femoral head can develop a flattening deformity; additionally, ...

    Thumbnail

    Influence of the Volume-Contact Area Ration on the Growth Behavior of the Cu-Sn Intermetallic Phase 

    Giddaluri, Venkatakamakshi Supraja (2015-12-21)
    Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic ...

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us
    TDL
    Theme by @mire NV
     

     

    Browse

    All of ResearchCommonsCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CommunityBy Issue DateAuthorsTitlesSubjects

    My Account

    Login

    Discover

    AuthorAruwajoye, Olumide (1)Giddaluri, Venkatakamakshi Supraja (1)Mishler, Michael Codie (1)Teimouri, Manouchehr (1)SubjectAmplification-free (1)bone material (1)Cu-Al intermetallic compound, IMC, Thin Film / Bulk diffusion couple, reaction induced diffusion, interface stress (1)ischemia (1)Nanoparticle bridge assay (1)Oligonucleotide detection (1)reflow time, stand off height, CGC model (1)||| (1)... View MoreDate Issued
    2015 (4)

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us
    TDL
    Theme by @mire NV