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INTERFACE REACTION INDUCED STRESS DEVELOPMENT IN AN ALUMINUM THIN FILM COPPER BULK PLATE DIFFUSION COUPLE
This thesis investigates the mechanism of the interface reaction induced intermetallic phase formation (IMC) and its impact on the interface reliability in Al-Cu diffusion couple pairing. This study is motivated by the ...
NANOPARTICLE-BRIDGE ASSAY FOR AMPLIFICATION-FREE ELECTRICAL DETECTION OF OLIGONUCLEOTIDES
The aim of this research is to investigate a highly sensitive, fast, inexpensive, and field-applicable amplification-free nanoparticle-based oligonucleotide detection method which does not rely on any enzymatic or signal ...
Material changes of bone following ishcemia of the immature femoral head
Legg-Calvé-Perthes disease (LCPD) is a childhood hip disorder resulting from the loss of blood flow to the femoral head. In severe cases of the disease, the femoral head can develop a flattening deformity; additionally, ...
Influence of the Volume-Contact Area Ration on the Growth Behavior of the Cu-Sn Intermetallic Phase
Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic ...