Browsing Department of Mechanical and Aerospace Engineering by Title
Now showing items 316-335 of 916
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E-LEARNING MODULES FOR NUCLEAR REACTOR HEAT TRANSFER
(2016-05-13)E learning in engineering education is becoming popular at several universities as it allows instructors to create content that the students may view and interact with at his/her own convenience. Web-based simulation and ... -
THE EFFECT OF BACILLE CALMETTE GUERIN IMMUNIZATION AND MOSQUIRIX VACCINE ON THE SPREAD OF CORONA VIRUS MARKOV CHAIN MONTE CARLO SIMULATION
(2020-05)**Please note that the full text is embargoed** ABSTRACT: This is on the development of a mathematical model to study the spread of COVID-19. A SEIR model with a modified MCMC-MH model was used to characterize the ... -
EFFECT OF CENTRIFUGAL FORCE ON THE LOAD CAPACITY OF THRUST GAS BEARING
(2022-12-12)It has been known for many decades that both rigid and foil thrust bearings are two options in the market for high-speed turbomachinery systems. Their advantages encompass the lower manufacturing cost, the lighter weight, ... -
Effect Of CRAC Location On A Fixed Rack Layout Of A Data Center
(Mechanical Engineering, 2007-08-23)Microprocessor driven escalation of thermal management needs has resulted in significant cooling challenges at the data center facility level, which can house thousands and tens of thousands of heat producing processors. ... -
Effect of Dielectric Inter-layer in Performance of the Multi-functional Material in Mechanical, Thermal and Environmental Loading Conditions
(2019-05-10)The demand for Electrical power storage devices for space shuttle, aircraft, car, bus and marine vehicles increased a great deal to have a greener and safer world. Decades of research has been done on development of light ... -
Effect Of Friction On The Zel'dovich Von Neumann Doring To Chapman Jouguet Transition
(Aerospace Engineering, 2010-11-01)Detonation theory proposes Chapman-Jouguet state of equilibrium due to the sonic speed of the products relative to the wave. Experimental observations however indicated the existence of a sub-Chapman-Jouguet state. The ... -
EFFECT OF MANUFACTURING-INDUCED DEFECTS AND ORIENTATION ON THE FAILURE AND FRACTURE MECHANISM OF 3D PRINTED STRUCTURES
(2016-12-20)Additive manufacturing is a rapidly growing cutting edge technology. Number of experimental studies have shown that strength of product manufactured by additive Fused Deposition Method (FDM) is influenced by different ... -
Effect Of Nanoparticle Dispersions In A Binary Nitrate Salt As Thermal Energy Storage Material In Concentrated Solar Power Applications
(Mechanical Engineering, 2013-07-22)Despite the huge improvements in the field of solar energy to produce electricity, the high cost of production has been one of the major problems in this field. Concentrated solar power (CSP) uses a number of mirrors to ... -
EFFECT OF PCB THICKNESS ON SOLDER JOINT RELIABILITY OF QFN PACKAGE UNDER POWER AND THERMAL CYCLING
(2017-01-13)Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ... -
Effect Of Pullout And Torsional Strength Of Composites With Co-molded Thread Inserts
(Mechanical Engineering, 2009-09-16)Rotorcraft transmission housings and drive system components are typically made from cast metals due to their highly complex geometries. Utilizing composite materials offers potential to reduce weigh and manufacturing cost ... -
The Effect of Room-Temperature Aging on Enthalpy and Dielectric Property of Carbon-Fiber/Epoxy Composite Prepreg and the Mechanical Property of Manufactured Composite
(2021-06-22)**Please note that the full text is embargoed** ABSTRACT: Fiber-based reinforced plastics are widely used materials in different industries - e.g., Automotive, Aerospace, Defense- because of their various advantages. The ... -
EFFECT OF SOLDER VOIDS AND DISTANCE TO NEUTRAL POINT (DNP) ON SJR OF WCSP UNDER REFLOW CONDITION AND THERMAL CYCLING
(2017-12-08)Since the introduction of Chip Scale Packages (CSP’s) in the early 2000s, they have become one of the biggest packaging trends in recent history. There are currently over 50 different types of CSP’s available throughout ... -
Effect Of Structural Design Parameters On Wafer Level CSP Ball Shear Strength And Their Influence On Accelerated Thermal Cycling Reliability
(Mechanical Engineering, 2010-07-19)Wafer level chip scale package (WLCSP) is one of the most popular packages due to its size and cost advantages. It is expected that the usage of WLCSP in microelectronics and MEMS industry combined is going to cross 16000 ... -
EFFECT OF STRUCTURAL VARIATIONS ON THERMAL DEFORMATION OF SINGLE CURVATURE COMPOSITE SANDWICH PANELS
(2016-05-10)Composite structures cured at a high temperature in a contoured female mold have a tendency to deform or spring-in when brought down to room temperature from cure temperature. This thesis investigates the effects of various ... -
Effect of Sulfur - Porous Carbon Cathode Morphology on the Discharge Process in Lithium-Sulfur Battery
(2019-08-14)In the present era, Lithium-ion (Li-ion) batteries are most commonly used in all electronic devices, but the demand for alternative energy increases rapidly due to the catastrophic climate caused by excess use of fossil ... -
EFFECT OF THERMAL CONDUCTIVITY, REYNOLDS NUMBER, ASPECT RATIO AND PACKING ARRANGEMENT ON RADIAL HEAT TRANSFER IN PACKED BEDS
(2021-08-10)The key motivation for this research is to study heat transfer developments in packed beds. The radial heat transfer enhancement of a packed bed in the laminar flow region is one of the major areas of ongoing research in ... -
Effect of Underfill Material & Gap Height on Reliability of low-k Large-Die Flip Chip Package under thermal Loading
The reliability assessment of package assembly is important to predict the performance of any microelectronic devices. Formation of fatigue cracks at the interface between the solder joint and component is the common failure ... -
EFFECT OF VISCOELASTIC MODELING OF PCB ON THE BOARD LEVEL RELIABILITY OF WAFER CHIP SCALE PACKAGE (WCSP) IN COMPARISON TO ORTHOTROPIC LINEAR ELASTIC MODELING
(2017-01-13)The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials ... -
Effect Of Warm Water Cooling For An Isolated Hybrid Liquid Cooled Server
(Mechanical Engineering, 2014-12)Data center cooling strategies have changed overtime due to increases in power densities and ever increasing server cooling power requirement. Traditionally, most data centers adopt air cooling where the Computer Room Air ... -
EFFECTIVE THERMAL CONDUCTIVITY OF POROUS MEDIA BY INVERSE HEAT TRANSFER ANALYSIS
(2017-12-07)This research describes the application of inverse analysis to estimate the thermal conductivity of a porous material using temperature measurements at the surfaces. Finite volume analysis code is implemented in MATLAB ...