Computational Analysis of Enhancing Heat Transfer in a 3-D stacked Die Using Different Finned Heat Sink

Abstract

3D die stacking is an exciting new technology that increases the transistor’s density by integrating two or more dies vertically with a dense high – speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die and across dies in a system. The objective of the thermal design requirement for a 3D stacked die package is to maintain the junction temperatures of the devices at or below specified limits. Installing the Heat sink aid the heat transfer activity from a package. The extent of cooling and the junction temperatures vary if the designs of the heat sinks change. Therefore, this study is to discover a heat sink which gives the best result in the heat extraction process.