EXPERIMENTAL ANALYSIS VALIDATING A CONTROL SCHEME TO DEVELOP A DYNAMIC COOLING SOLUTION FOR NON-UNIFORM HIGH POWERED ELECTRONIC DEVICES IN DATA CENTER
Abstract
The trend towards higher heat fluxes and non-uniform power distribution continues as we follow Moore’s law with technology nodes now approaching 10nm. Cooling is always designed for maximum junction temperature and as such it is important to mitigate hot spots. All cold plates have a static design by nature and do not possess the capability to respond to non-uniform heat dissipation. The unique “dynamic cold plate” concept aims to improving on conventional static designs through implementation of sensing and control, by redistributing the liquid across its body to counter varying power dissipation across the device being cooled.