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dc.contributor.advisorAgonafer, Dereje
dc.contributor.advisorSingh, Prabjit
dc.contributor.advisorHaji-Sheikh, Abdolhossein
dc.creatorPujara, Kanan
dc.date.accessioned2018-02-01T14:55:52Z
dc.date.available2018-02-01T14:55:52Z
dc.date.created2015-12
dc.date.issued2015-12-22
dc.date.submittedDecember 2015
dc.identifier.urihttp://hdl.handle.net/10106/27125
dc.description.abstractData center consume a significant amount of energy for the continuous air-conditioning of the servers with high internal heat loads and to maintain the indoor temperatures within recommended operating levels as recommended by ASHRAE. As an alternate source to air-conditioning, air-side economizers are used to reduce power consumption. However, there is a reluctance in using this technique due to undetermined equipment reliability by introducing outside air pollutants which over time could cause failures. There is a need to know the degree of reliability degradation when the equipment is operated, outside the recommended range, in the allowable temperature-humidity range in geographies with high levels of gaseous and particulate contamination. There are many modes of hardware failure under harsh temperature-humidity conditions. This work restricts itself to the effect of temperature and humidity on corrosion-related hardware failures, in sulfur-bearing gaseous contaminated environments, by studying copper and silver corrosion rates as a function of temperature and humidity. An ASHRAE survey of data centers has shown that there is a strong relationship of corrosion-related hardware failure frequency to copper and silver corrosion rates under various temperature and relative humidity ranges. The gaseous contamination is provided in the form of approximately 70 ppb free sulpur in a flowers of sulpur (FOS) chamber maintained at 30̊C constant temperature. The humidity in the FOS chamber is maintained at various levels by using saturated salt solutions and the thin film temperature is maintained at various levels between 30 and 50˚C by the joule heating of the films. The corrosion rates of copper and silver, in a 30̊C ambient with ~70 ppb free sulfur, are plotted in the upper right corner of the ASHRAE A1-A4 allowable temperature-humidity ranges. For the first time, corrosion data are provided on the psychrometric chart in a form convenient for obtaining the x-factors for temperature and humidity for corrosion-related hardware failures. This work does not address the role of particulate contamination
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.subjectASHRAE
dc.subjectCorrosion
dc.subjectGaseous contamination
dc.subjectSulphur
dc.subjectHardware failures
dc.titleThe Effect of Temperature and Relative Humidity on the Corrosion Rates of Copper and Silver in Electronic Equipment in the presence of Sulfur Environment
dc.typeThesis
dc.date.updated2018-02-01T14:57:59Z
thesis.degree.departmentMechanical and Aerospace Engineering
thesis.degree.grantorThe University of Texas at Arlington
thesis.degree.levelMasters
thesis.degree.nameMaster of Science in Mechanical Engineering
dc.type.materialtext
dc.creator.orcid0000-0002-6871-4726


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