Performance Optimization Of Multi-core Processors Using Core Hopping - Thermal and Structural
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As the work load on the single core processor increases, it's processing speed increases resulting in increased power densities and die temperatures. The increase in die temperature results in decreased performance and reliability and increased leakage currents and cooling costs. In order to decrease the work load and the cooling cost on the single core processor, multi-core processors have been implemented. Multicore Processors also known as Chip Multi Processors (CMP's) are the processors which contain two or more independent cores on a chip. In CMPs, if one core reaches its critical temperature, the workload is transferred to the other. This phenomenon is termed as core hopping. Also, the non-uniform power distribution across the die is not uniform, resulting in hot spots. Core hopping results in the uniform distribution of the work load among the many cores and leads to performance and reliability improvement. The demand for greater performance in applications involving high levels of computing has resulted in many cores being put on a single chip. Every succeeding processor is predicted to hold double the number of cores than previous one. In this study, core hopping for CMPs is analyzed and thermal analysis of the chip is performed using ANSYS. Furthermore, the hop sequence will be optimized as a function of chip temperature distribution and thermo-mechanical analysis of the package will be carried out to estimate its structural integrity.