Browsing by Author "13c4e2ff-b06e-41e4-992e-3f913fb22666"
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Compact modeling methodology development for thermomechanical assessment in high-end mobile applications-planar and 3D TSV packages
Mirza, Fahad (2014-12)For the last few decades, Moore's law has been driving the microelectronics industry to achieve high performance with small form-factors at a reasonable cost. The continued miniaturization of the transistors has resulted ...