Browsing by Author "Kim, Choong-Un"
Now showing items 21-25 of 25
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STUDY OF INTERDIFFUSION AND GROWTH OF INTERMETALLIC COMPOUNDS IN BIMETALLIC LAYERS OF ALPHA BRASS AND Al-Mg ALLOY
Kota, Ratan; 0000-0003-3917-9856 (2020-08-17)This work aims to study the formation of Inter Metallic Compounds (IMC’s) and their growth rate in Brass and Al-Mg alloy. This diffusion couple consists of four elements Aluminum, Copper, Zinc and Magnesium. Aluminum and ... -
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
Osmanson, Allison Theresa; 0000-0001-8737-3915 (2021-12-13)As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ... -
Study On The Leakage Current Behavior And Conduction Mechanism Of Porous Low-k In Cu/porous Low-k Interconnects: The Influence Of Extrinsic Factors
Chen, Liangshan (Materials Science & Engineering, 2010-11-01)This study investigates the influence of extrinsic factors including moisture and impurities trapped in porous low-k (PLK) and defective diffusion barrier on the leakage current behavior and the associated conduction ... -
Temperature-dependence Of Stress-related Phenomena
Saptono, Rahmat (Materials Science & Engineering, 2014-07-14)Efforts have been made to develop a simple but physically sound model. The model was specifically proposed to capture, explain, and estimate the temperature sensitivity and strengthening mechanism phenomena in small volume ... -
Thermal Failure Mechanism And Voltammetry Metrology For Cu/barrier/low K Integration
Meng, Dongmei (Materials Science & Engineering, 2007-08-23)The present study investigates the thermal stability of Cu/barrier/porous low κ (PLK) integration first, and then a new characterization method based on voltammetry is developed to characterize quality of diffusion ...