Browsing by Author "Anaskure, Avinash"
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EFFECT OF VISCOELASTIC MODELING OF PCB ON THE BOARD LEVEL RELIABILITY OF WAFER CHIP SCALE PACKAGE (WCSP) IN COMPARISON TO ORTHOTROPIC LINEAR ELASTIC MODELING
Anaskure, Avinash (2017-01-13)The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials ...