Browsing by Author "Barua, Trina"
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A COMPARATIVE STUDY OF THE THERMO-MECHANICAL BEHAVIOR OF WCSP ASSEMBLY DUE TO DIFFERENCE IN PCBS’ LAYER THICKNESS
Barua, Trina; 0000-0002-6483-8553 (2016-05-10)The reliability of Chip Scale Package assembly is of great concern for the electronic industry. Due to multiple function integration of the present devices there is a high demand of ultra-miniaturization of the integrated ...