Browsing by Subject "CTE"
Now showing items 1-4 of 4
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Effect of Underfill Material & Gap Height on Reliability of low-k Large-Die Flip Chip Package under thermal Loading
The reliability assessment of package assembly is important to predict the performance of any microelectronic devices. Formation of fatigue cracks at the interface between the solder joint and component is the common failure ... -
EVALUATION OF SOLDER ALLOYS FOR BGA PACKAGE: A COMPARATIVE RELIABILITY STUDY USING ANSYS COMPUTATIONAL ANALYSIS
(2023-05-22)Temperature cycling failure of solder joints in Ball Grid Array (BGA) packages has become a critical issue in electronic manufacturing. This thesis specifically characterizes three different lead-free solder alloys (Pure ... -
IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ... -
MEASUREMENT OF CHANGE IN CTE OF PCBS DUE TO SINGLE PHASE IMMERSION COOLING AND IMPACT OF CHANGED PROPERTIES OF PCBS ON SOLDER JOINT RELIABILITY OF BGA PACKAGE
(2020-06-05)Oil immersion cooling in high-density data centers is emerging as an alternative for traditional air cooling because of the less power consumption, capacity to handle high power density and less space requirement. To adopt ...