Browsing by Subject "Drop test"
Now showing items 1-4 of 4
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FINITE ELEMENT ANALYSIS OF COMPOSITE AIRCRAFT FUSELAGE FRAME
(2017-05-15)Composites have been introduced in aircraft industries, for their stronger, stiffer, and lighter properties than their metal-alloys counterparts. The general purpose of an aircraft is to transport commercial or military ... -
Impact of Layer Thickness of QFN Package Mounted Printed Circuit Boards During Drop Testing
(2015-12-17)In past studies, it was established that board level reliability of the packages depends mainly upon the design of the package and the soldering technology used for mounting the components. There are many methods to test ... -
MULTI-PHYSICS DESIGN OPTIMIZATION OF 2D AND ADVANCED HETEROGENOUS 3D INTEGRATED CIRCUITS
(2018-08-27)The convergence and miniaturization of computing and communications dictate building up rather than out. As planar device miniaturization continues to its ultimate limits, the complexity of circuit interconnections for 2-D ... -
RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS USING DROP TESTING
(2018-01-09)In electronic industry Ball grid array (BGA) package, surface mount technology has been used widely, due to its robust design, high density connections and improved performance. In surface mount technology, solder joints ...