Browsing by Subject "High frequency laminates"
Now showing items 1-2 of 2
-
RELIABILITY ASSESSMENT OF SOLDER JOINT INTERCONNECTS OF BGA PACKAGE-MEGTRON SERIES UNDER POWER CYCLING
(2017-12-11)Solder joint interconnects are the second level assembly in surface mount interconnection technology. Mismatch in the coefficient of thermal expansion (CTE) between package and substrate or PCB creates failure in solder ... -
RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS USING DROP TESTING
(2018-01-09)In electronic industry Ball grid array (BGA) package, surface mount technology has been used widely, due to its robust design, high density connections and improved performance. In surface mount technology, solder joints ...