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ELECTROMIGRATION INDUCED INTERFACE REACTION IN Cu-WIRE / Al-PAD DIFFUSION COUPLE
(2017-01-17)
This dissertation presents experimental observations that may assist the understanding of electromigration (EM) failure mechanism active in Cu wire and Al thin film pad (wire bond). This study is motivated by an ongoing ...
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
(2021-12-13)
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ...
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...
The Effects of SnAgCu Solder Interconnect Package’s Parameters on Electromigration Failure Mechanisms
(2021-12-17)
The primary concern of this dissertation is the electromigration (EM) failure mechanism found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) packaging structure and factors affecting ...
STUDY OF ALLOY EFFECT ON ELECTROMIGRATION IN SN SOLDER ALLOYS
(2023-05-22)
This dissertation presents experimental results about the alloy effect on the Electromigration (EM) of Sn in Sn-based binary and ternary alloys. By using cross-stripe configuration, the alloy effect on EM of Sn can be ...