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SOLDER JOINT DESIGN OPTIMIZATION OF QUAD-FLAT PACKAGE WITH GULLWING LEADS UNDER ACCELERATED THERMAL CYCLING AND POWER CYCLING
(2018-07-10)
Ever growing complexity in designing of Integrated Circuits and accommodating high number of Interconnections in the device is the main source of motivation in today’s world of IC devices. Quad Flat Package (QFP) with ...
Solder Ball Reliability Assessment of Wafer Level Chip Scale Package (WLCSP) Through Power Cycling
(2016-12-20)
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ...