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EFFECT OF SOLDER VOIDS AND DISTANCE TO NEUTRAL POINT (DNP) ON SJR OF WCSP UNDER REFLOW CONDITION AND THERMAL CYCLING
(2017-12-08)
Since the introduction of Chip Scale Packages (CSP’s) in the early 2000s, they have become one of the biggest packaging trends in recent history. There are currently over 50 different types of CSP’s available throughout ...