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Characterization of Fatigue Strength of Additively Manufactured Ti-6Al-4V with Recoater Blade Interference Flaws and Residual Stresses Towards an Enhanced Fatigue Substantiation Methodology for Aerospace Structures Applications
(2022-08-17)
This research characterized the fatigue strength of additively manufactured (AM) Ti-6Al-4V, through fatigue and static tests conducted using specimens with and without recoater blade interference flaws (RBIF), and thus ...
COMPUTATIONAL RELIABILITY ANALYSIS OF BLIND MICRO-VIA WITH 3D AND AXISYMMETRIC MULTI-LAYER PCB
(2022-05-18)
Micro-via are components that are used to form connections from one layer to another in most Multilayered Printed Circuit Boards (PCBs). The failure of Micro-via has always been a concern of the electronic industry. The ...
IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
(2021-12-13)
As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ...
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...
RELIABILITY ENHANCEMENT OF HETEROGENEOUS 3D INTEGRATED CIRCUIT AND CHARACTERIZATION OF THERMAL INTERFACE MATERIAL
(2020-08-28)
Electronic products require high functional integration in small footprints with lower cost. At the same time, it is required to maintain effective communication between the IC’s and the electronic systems. Various challenges ...
Assessment of Joule Heating Properties of Various Solder Alloys in BGA Assembly
(2023-05-22)
The continuing demands for smaller, yet higher performance devices have resulted in many revolutionary changes in device packaging in recent years, including the change in package form factors, structure, and the type of ...