Browsing Library by Author "Chaudhari, Mugdha Anish"
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RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA PACKAGE – MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT BOARDS
Chaudhari, Mugdha Anish (2017-05-24)When it comes to the mechanical and electrical seam of the Printed Circuit Board (PCB) and package, reliability of the board plays a major impact on PCB. As the frequency increases, losses in signals increase. This ...