Browsing Library by Author "Conjeevaram, Bhavna"
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Solder Ball Reliability Assessment of Wafer Level Chip Scale Package (WLCSP) Through Power Cycling
Conjeevaram, Bhavna (2016-12-20)Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ...