Browsing Library by Subject "Cu-Al intermetallic compound"
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INTERFACE REACTION INDUCED STRESS DEVELOPMENT IN AN ALUMINUM THIN FILM COPPER BULK PLATE DIFFUSION COUPLE
(2015-12-18)This thesis investigates the mechanism of the interface reaction induced intermetallic phase formation (IMC) and its impact on the interface reliability in Al-Cu diffusion couple pairing. This study is motivated by the ...