Browsing Library by Subject "Electronic packages"
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Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB's and Reliability of Electronic Packages
(2019-05-17)Immersion cooling technique is used for the thermal management of high-density data centers to avoid overheating of components and failure of servers. However, to use this as a viable cooling technique, the effect of ... -
STUDY OF CRACK PROPAGATION UNDER THERMAL LOADING ON A 3D TSV PACKAGE
(2016-09-16)Today, there is a revolution in going for miniaturization in size of electronic packages. More thinner, lighter and complex packages are in use for almost every electronic device. This initiation was taken to the next level ...