Search
Now showing items 1-3 of 3
ELECTROMIGRATION INDUCED INTERFACE REACTION IN Cu-WIRE / Al-PAD DIFFUSION COUPLE
(2017-01-17)
This dissertation presents experimental observations that may assist the understanding of electromigration (EM) failure mechanism active in Cu wire and Al thin film pad (wire bond). This study is motivated by an ongoing ...
STUDY OF INTERDIFFUSION AND GROWTH OF INTERMETALLIC COMPOUNDS IN BIMETALLIC LAYERS OF ALPHA BRASS AND Al-Mg ALLOY
(2020-08-17)
This work aims to study the formation of Inter Metallic Compounds (IMC’s) and their growth rate in Brass and Al-Mg alloy. This diffusion couple consists of four elements Aluminum, Copper, Zinc and Magnesium. Aluminum and ...
STUDY OF COPPER-RICH INTERMETALLIC PHASE FORMATION IN COPPER-ALUMINUM BINARY SYSTEM
(2018-05-04)
This work aims to study the initial formation and subsequent growth of intermetallic compounds (IMC) in the binary Al-Cu system. Al-Cu pair configurations have been successfully used for several decades as structural ...