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CHARACTERIZING CONTAMINATION TO EXPAND ASHRAE ENVELOPE IN AIRSIDE ECONOMIZATION AND THERMAL AND RELIABILITY IN IMMERSION COOLING OF DATA CENTERS
(2018-08-24)
The Datacom facility which comprises rooms or closets used for communication, computers/servers or electronic equipment requires cooling unit which consumes 31% (23% HVAC cooling + 8% HVAC fans) of overall energy. The ...
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...