Search
Now showing items 1-2 of 2
IMPACT OF THERMAL AGING ON CRACK GROWTH BEHAVIOR OF LEAD FREE SOLDER INTERCONNECTS
(2018-05-24)
Reliability assessment helps in better performance of electronic packages. This also helps electronic device manufacturing company as well as the users to evaluate the life of any device. The microstructure, mechanical ...
IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...