Search
Now showing items 1-1 of 1
SOLDER JOINTS DESIGN OPTIMIZATION OF QFN PACKAGES FOR DIFFERENT BOARDS BY INVESTIGATING SOLDER JOINT RELIABILITY
(2017-05-30)
Quad Flat No-lead package (QFN) is one of the most cutting-edge technologies emerged in the market, exhibiting high performance and efficiency with unparalleled cost effectiveness. QFN, a leadless package, is an ideal ...