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MULTI-PHYSICS DESIGN OPTIMIZATION OF 2D AND ADVANCED HETEROGENOUS 3D INTEGRATED CIRCUITS
(2018-08-27)
The convergence and miniaturization of computing and communications dictate building up rather than out. As planar device miniaturization continues to its ultimate limits, the complexity of circuit interconnections for 2-D ...
Effect of Underfill Material & Gap Height on Reliability of low-k Large-Die Flip Chip Package under thermal Loading
The reliability assessment of package assembly is important to predict the performance of any microelectronic devices. Formation of fatigue cracks at the interface between the solder joint and component is the common failure ...