Search
Now showing items 1-1 of 1
Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Printed Circuit Boards of Varying Thickness
(2016-05-10)
In the electronic industry one of the popular package is Chip Scale Package (CSP) due to its small form factor and low cost. To meet the need of new functionality and portability of the recent devices, CSPs’ have been most ...