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THERMO-MECHANICAL ANALYSIS OF HETEROGENOUS INTEGRATED PACKAGES AND IMMERSION COOLING OF DATA CENTER SERVERS
(2023-12-18)
**Please note that the full text is embargoed until 02/01/2026** III-V materials such as Gallium Arsenide (GaAs) and Indium Phosphide (InP) are used as substrates for opto-electronic devices like vertical cavity surface ...