Browsing Theses and Dissertations(library) by Author "Chepuri Krishna Teja, Venkata"
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Thermal Enhancement Of Stacked Dice Replacing Wire Bonds With Through Silicon Vias At Location Of Die Pads
Chepuri Krishna Teja, Venkata (Mechanical Engineering, 2008-04-22)Through Silicon vias can offer quick time to market of circuits designed in a modular manner and can also be used to customize the product according to the needs of the customers. This gives a way to avoid both excess ...