Browsing Theses and Dissertations(library) by Author "Dereje, Agonafer"
Now showing items 1-12 of 12
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CFD Analysis and Design Optimization of Heat Sink for Oil Immersion Cooling
Epuri, Koushik (2016-05-11)Air cooling is predominant cooling technique employed in most of the data centers. As the demand for High performance computing (HPC) which deploy large concentration of high-end servers (30 kW to 200 kW per rack) is ... -
CFD Analysis of Thermal Shadowing and Optimization of Heat sinks in 3rd generation Open compute server for single phase immersion cooling applications
Dandamudi, Ravya (2018-05-24)In today’s networking world, utilization of servers and data center has been increasing significantly. Increasing demands of processing and storage of data causes corresponding increase in power density of servers. The ... -
COMPUTATIONAL RELIABILITY ANALYSIS OF BLIND MICRO-VIA WITH 3D AND AXISYMMETRIC MULTI-LAYER PCB
Bazaru, Jayendra; 0000-0002-2217-5085 (2022-05-18)Micro-via are components that are used to form connections from one layer to another in most Multilayered Printed Circuit Boards (PCBs). The failure of Micro-via has always been a concern of the electronic industry. The ... -
Design And Optimization Of Heat Spreaders And Selection Of Fan In Laptop
Manne Sambaiah, Kranthi Kumar (Mechanical Engineering, 2007-08-23)Technical advancements lead to the need for faster processors and reduced sizes in electronic systems. The urge for faster and compact systems leads to two major problems. Firstly over heating of chips which degrade the ... -
DESIGN AND PARAMETRIC ANALYSIS OF FLOW CONTROL DEVICE FOR DYNAMIC COLD PLATE TO OPTIMIZE THE TEMPERATURE FLUCTUATIONS OF THE MULTI-CHIP MODULE
Veluturla, Avinash; 0000-0001-5005-4080 (2016-05-10)Continuing trends of increasing microprocessor power densities and non-uniform temperature distribution pose a significant challenge to the data center cooling. The most usual approach to data center cooling is air cooling ... -
Design Of Next Generation Antenna Mounts In Telecommunication Towers With Low Effective Projected Area
Puthota Dominic Savio, Ruben GregoryDesign of new antenna mount with low effective projected area (EPA) and high load carrying capacity for telecommunication towers is the purpose of this thesis. The main aim is to reduce the EPA of the mount against the ... -
DEVELOPMENT OF A METHODOLOGY AND SAMPLE PREPARATION TO EVALUATE RELIABILITY OF OIL COOLED DATA CENTER
Kota, Venkata Naga Indu Sravani (2015-12-10)Liquid immersion cooling is not a new concept which is slowly emerging as an alternative solution to conventional chilled air cooling systems for data centers. The main idea is to build a body of knowledge to help industry ... -
Effect Of Warm Water Cooling For An Isolated Hybrid Liquid Cooled Server
Addagatla, Alekhya (Mechanical Engineering, 2014-12)Data center cooling strategies have changed overtime due to increases in power densities and ever increasing server cooling power requirement. Traditionally, most data centers adopt air cooling where the Computer Room Air ... -
Experimental And Computatonal Analysis Of The Effect Of PCB Layer Copper Thickness And Prepreg Layer Stiffness On Solder Joint Reliability
Mahesan Revathi, SanjayThe emphasis of this study is to find out how the solder joints of the BGA package are affected with change in the stack up PCB layer copper thickness and the prepeg layer stiffness. In general the effect of the PCB layer ... -
NON THERMAL RELIABILITY CONSIDERATIONS FOR OIL COOLED DATA CENTERS AND ITS SERVICEABILITY
Nagilla, Sahithi Reddy (2015-12-09)The interest in Oil immersion cooling is increasing day by day which can be attributed to the recent research that shows the potential of its performance when compared to other techniques that add a little more expenses ... -
PARAMETRIC STUDY OF AN IGBT COLD PLATE AND AFFECT OF DEVICE LEVEL MODELLING ON SYSTEM LEVEL THERMAL PREDICTIONS
Kadaba Nagaraja Urs, Abhishek Raj Urs; 0000-0001-6924-081X (2016-02-29)In power electronics, as there is continuous increase in performance of the electronic devices, simultaneously the size of the components used in these devices keep on decreasing. This has resulted in increased power ... -
Thermal Enhancement Of Stacked Dice Replacing Wire Bonds With Through Silicon Vias At Location Of Die Pads
Chepuri Krishna Teja, Venkata (Mechanical Engineering, 2008-04-22)Through Silicon vias can offer quick time to market of circuits designed in a modular manner and can also be used to customize the product according to the needs of the customers. This gives a way to avoid both excess ...