Browsing Theses and Dissertations(library) by Author "Kumar, Ratan"
Now showing items 1-16 of 16
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Accelerated Performance Degradation of Single-Phase Cold Plates for Direct-to-chip Liquid Cooled Data Centers
Chinthaparthy, Lochan Sai Reddy; 0000-0003-1128-7281 (2021-12-21)Expanding demands for cloud-based computing and storage, the Internet of Things, and AI-based applications have escalated thermal loads in high-density data centers which necessitated the utilization of more efficient ... -
DESIGN AND CFD ANALYSIS OF A TANK SOLUTION FOR NATURAL CONVECTION BASED SINGLE-PHASE IMMERSION COOLING OF SERVERS
Khanvilkar, Siddhesh Manohar (2021-05-17)The issue of thermal management of data centers is becoming even more challenging with increasing chip power densities. This has been primarily driven by increasing demands in artificial intelligence and machine learning-based ... -
DESIGN AND CFD ANALYSIS OF BIMETALLIC BASED PASSIVE DYNAMIC COLD PLATE FOR HIGH POWER DIRECT-TO-CHIP LIQUID COOLING
Deshmukh, Apurv Pravin (2021-08-18)Rising demand for high-performance chips results in the need for advanced and efficient cooling technologies like direct to chip liquid cooling. Cold plates based utilizing direct liquid cooling is one of the most efficient ... -
DESIGN, DEVELOPMENT, AND CHARACTERIZATION OF A FLOW CONTROL DEVICE FOR DYNAMIC COOLING LIQUID-COOLED SERVERS
Hurnekar, Hardik Yashwant (2021-05-15)Since the early ’60s, based on Moore’s law, transistor density has been doubling every generation resulting in increased power density. Eventually, in the early ’90s, we moved from constant voltage to constant electric ... -
DEVELOPMENT OF A TEST METHOD FOR CHARACTERIZING AN INDIRECT EVAPORATIVE COOLING MODULE FOR DATA CENTER COOLING APPLICATION
Bhosale, Abhijit Rajendra (2021-05-09)Evaporative cooling is a smarter way of maintaining optimum operating conditions in data centers. Indirect Evaporative Cooling (IEC) provides the advantage of cooling without changing the humidity of the Data Center (DC) ... -
E-LEARNING MODULES FOR NUCLEAR REACTOR HEAT TRANSFER
Jayaram, Praveen Bharadwaj (2016-05-13)E learning in engineering education is becoming popular at several universities as it allows instructors to create content that the students may view and interact with at his/her own convenience. Web-based simulation and ... -
EVALUATION OF SOLDER ALLOYS FOR BGA PACKAGE: A COMPARATIVE RELIABILITY STUDY USING ANSYS COMPUTATIONAL ANALYSIS
Muthegowda, Yashvanth (2023-05-22)Temperature cycling failure of solder joints in Ball Grid Array (BGA) packages has become a critical issue in electronic manufacturing. This thesis specifically characterizes three different lead-free solder alloys (Pure ... -
IMPROVING THE IMPINGEMENT COLD PLATE THERMAL DESIGN USING NUMERICAL AND ANALYTICAL APPROACH
Madhuker, Reuben Joshua (2021-05-15)Conventional cooling methods for an IC chip uses heat spreader to transfer heat from the chip end of the spreader to the opposite end of the spreader which then uses air or water to remove heat and thereby maintaining the ... -
Inverse Analysis of Heat Generating Body for Safety Applications
Patil, Sandeep; 0000-0002-5648-9322Inverse thermal analysis and its applications have been applied to numerous fields of science and engineering. Historically during the 1950's and early 1960's, space programs played a significant role in the advancement ... -
MECHANICAL AND THERMAL PERFORMANCE OF ADDITIVELY MANUFACTURED DIGITAL MATERIALS
Ahmad, Layth Muayyad; 0009-0006-5295-5652 (2023-05-19)**Please note that the full text is embargoed until 05/15/2024** ABSTRACT: Over the past decades, additive manufacturing has become a critical material processing tool. All ranges of materials including polymers, composites, ... -
OPTIMUM DESIGN OF SHIMMED FOIL BEARING CONSIDERING ROTORDYNAMIC STABILITY
Atluri, Venkata Sai Jyothish; 0000-0003-4255-6114 (2020-08-10)Air foil bearing technology has made substantial development in the past years and has found its applications in high speed turbomachinery. Yet the rotordynamic instability has still been a persisting issue in the single ... -
Parametric Multi-Objective Optimization of Cold Plate for Single-Phase Immersion Cooling
Joseph Nattasseriedathil, Geevarghese; 0009-0000-5514-9900 (2023-05-19)**Please note that the full text is embargoed until 05/16/2025** ABSTRACT: The increasing demand for high performance computing in applications such as Internet of Things, Deep Learning, Big data for crypto-mining, virtual ... -
Reliability of a 2.5D TSV package
Gaikwad, Neha Vinayak (2018-08-13)In the recent years, the Through Silicon Vias (TSVs) are helping a huge variety of the 3D IC and the 2.5D IC packaging applications to try to fulfill their requirements of functionality and higher connectivity at the expense ... -
Reverse Engineering to Create High Quality Polymer Parts Using Additive Manufacturing
Channa, Gurtej Singh Tarsem Singh; 0000-0002-3728-1905 (2022-01-10)Reverse engineering is a process of recreating parts for which the tools no longer exist, reducing the cost of an original part by manufacturing it in-house or redesigning and improving the original part's function. This ... -
Synthesis and Characterization of Graphene-Reinforced Polymer Filaments for Additive Manufacturing
Menezes, Sean; 0000-0002-9773-3205 (2021-12-21)Fused Deposition Modeling (FDM) is a popular 3D printing process which uses a spool of thermoplastic polymer filament that is melted by the movable extruder printer head onto the bed to generate the required shape. The ... -
THERMAL DESIGN ANALYSIS OF SERVER CHASSIS MANIFOLDS FOR LIQUID COOLED SERVERS USING CFD
Adsul, Kaustubh Kantilal (2021-05-18)Direct-to-chip liquid cooling is one of the most popular methods in data center thermal management when it comes to cooling high chip power densities. A cold plate-based liquid cooling system contains various components ...