Browsing Theses and Dissertations(library) by Author "Pallapothu, Mahesh"
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RELIABILITY ASSESSMENT OF SOLDER JOINT INTERCONNECTS OF BGA PACKAGE-MEGTRON SERIES UNDER POWER CYCLING
Pallapothu, Mahesh (2017-12-11)Solder joint interconnects are the second level assembly in surface mount interconnection technology. Mismatch in the coefficient of thermal expansion (CTE) between package and substrate or PCB creates failure in solder ...