Search
Now showing items 1-1 of 1
Multi-objective Design Optimization Of BEol/fBEol Region During Chip Attachment To Substrate
(Mechanical Engineering, 2014-03-12)
Semiconductor industry has recognized the need to replace traditional Al/SiO2 interconnects with Cu/Low-k interconnects in the mainstream electronics devices following the latter's impact on power, RC delay, and cross-talk ...