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Solder Ball Reliability Assessment of Wafer Level Chip Scale Package (WLCSP) Through Power Cycling
(2016-12-20)
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When ...
Analysis of Rater Reliability Using a Faculty Developed, Revised OSCE Evaluation Instrument
(2016-08-12)
Nurse educators need valid and reliable instruments to evaluate student performance during summative clinical experiences and Objective Structured Clinical Examinations (OSCEs). The purpose of this retrospective, secondary ...