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IMPACT OF MATERIAL MODELS ON IMMERSION COOLED ELECTRONICS PACKAGES AND RELIABILITY ASSESSMENT FOR CHIP-PACKAGE INTERACTION
(2021-05-13)
The immersion cooling for IT equipment has been around for decades. From thermal energy management perspective, immersion cooling is better than traditional cooling technology. However, there is need for more work in open ...
ANALYZING THE THERMOMECHANICAL PERFORMANCE OF TG400G MATERIAL SUBSTRATE CORE UNDER IMMERSION COOLING
(2023-08-15)
The relentless surge in demand for seamless information exchange through consumer electronics, driven by the indispensable role of the Internet, has given rise to an unprecedented need for data centres. Yet, the energy ...