Search
Now showing items 1-1 of 1
IMPACT OF VISCOELASTIC PROPERTIES OF LOW LOSS PRINTED CIRCUIT BOARDS (PCBs) ON RELIABILITY OF WCSP PACKAGES UNDER DROP TEST
(2020-06-08)
Reliability of electronic packages is a major concern as different failure modes are induced due to factors such as temperature loads, mechanical stresses, humidity, corrosion and so on. Finite element analysis (FEA) is ...