Browsing Department of Materials Science and Engineering by Author "Meng, Dongmei"
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Thermal Failure Mechanism And Voltammetry Metrology For Cu/barrier/low K Integration
Meng, Dongmei (Materials Science & Engineering, 2007-08-23)The present study investigates the thermal stability of Cu/barrier/porous low κ (PLK) integration first, and then a new characterization method based on voltammetry is developed to characterize quality of diffusion ...