Browsing Department of Materials Science and Engineering by Subject "Failure"
Now showing items 1-2 of 2
-
STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT
(2021-05-09)The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ... -
STUDY OF INTERDIFFUSION AND GROWTH OF INTERMETALLIC COMPOUNDS IN BIMETALLIC LAYERS OF ALPHA BRASS AND Al-Mg ALLOY
(2020-08-17)This work aims to study the formation of Inter Metallic Compounds (IMC’s) and their growth rate in Brass and Al-Mg alloy. This diffusion couple consists of four elements Aluminum, Copper, Zinc and Magnesium. Aluminum and ...