Browsing Department of Materials Science and Engineering by Subject "Failure mechanism"
Now showing items 1-1 of 1
-
The Effects of SnAgCu Solder Interconnect Package’s Parameters on Electromigration Failure Mechanisms
(2021-12-17)The primary concern of this dissertation is the electromigration (EM) failure mechanism found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) packaging structure and factors affecting ...