Browsing Department of Materials Science and Engineering by Subject "Finite element method"
Now showing items 1-2 of 2
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A study of effect of bond length on bond strength using transient heat transfer analysis
(2018-08-17)It is important to understand the mechanical properties of the bonding between the adjacent layers of 3D printed parts build by fused deposition modeling. The bonding process is highly nonlinear and depends on various ... -
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
(2021-12-13)As the shrinkage of electronic devices becomes more appealing, so do their high capacity and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend predicted by Moore’s Law. To achieve ...