Browsing Department of Materials Science and Engineering by Subject "Micro solder joint"

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    • STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT 

      Madanipour, Hossein; 0000-0001-5298-5065 (2021-05-09)
      The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables ...